Multilayer PCB
Multilayer circuit boards for dense routing, clean power distribution and signal isolation, built to the stack-up agreed during engineering review.
Multilayer PCB with ShinePCB
Multilayer boards stack signal, ground and power layers so complex circuits fit in less space. We review your layer structure, materials and drill data together, and confirm the construction and layer count for each project before quotation.
- Layer structure and stack-up against your targets
- Material and thickness for the application
- Drill and via strategy
- Copper balance and registration considerations
Capability and certificates
| Positioning | 4–48 Layers | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| Multilayer PCB | 4–48L | 4–48L |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
- CQCCQC20001245054
- IATF 16949:2016NQA T14016 / IATF 0498905
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Multilayer capability
| Parameter | Prototype | Mass production |
|---|---|---|
| Layer count (max) | 48L | 36L |
| Finished board thickness | 0.2–15.0 mm | 0.3–7.0 mm |
| Thickness tolerance | ±8% | ±8% |
| Min trace / space | 1.5 / 1.5 mil | 2 / 2 mil |
| Min hole-to-trace clearance | 5 mil | 5 mil |
| Copper weight | 1–12 oz | 1/3–8 oz |
| Layer registration accuracy | 0.8 mil | 1 mil |
| Min through-hole diameter | 0.075 mm | 0.10 mm |
| Max aspect ratio | 35:1 | 30:1 |
| Impedance control tolerance | ±5% | ±7% |
| Surface finish | ENIG, hard gold, immersion tin, immersion silver, OSP, carbon | ENIG, hard gold, immersion tin, immersion silver, OSP, carbon |
| Material types | Shengyi, Taiwan Union, ITEQ, Nan Ya, Rogers, Panasonic, Isola (Tg135 / Tg150 / Tg170, CAF / CTI>600, halogen-free) | Same material families as prototype |
Source: ShinePCB capability workbook, 2025 values. Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
Typical applications
Industrial controllers and instruments
Communication and networking hardware
Automotive and power electronics modules
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
Multilayer PCB FAQs
Can you propose a stack-up for my design?
Yes. Share your layer count, thickness and impedance targets, and engineering will propose or check a stack-up during review.
Are prototype and production builds reviewed the same way?
Both are reviewed, but prototype and production requirements are kept separate so the production build is confirmed on its own terms.
